Supported instruction sets | AVX-512 |
Tcase | 77 °C |
Processor base frequency | 2.5 GHz |
On-board graphics card | N |
Discrete graphics card model | Not available |
Memory clock speeds supported by processor | 2667 MHz |
Intel® vPro™ Platform Eligibility | Y |
Discrete graphics card | N |
Cooler included | N |
Harmonized System (HS) code | 8542310001 |
Box | N |
Status | Launched |
Launch date | Q2'19 |
PCI Express CEM revision | 3.0 |
Intel Turbo Boost Max Technology 3.0 | N |
Intel® Speed Shift Technology | Y |
AVX-512 Fused Multiply-Add (FMA) units | 1 |
Number of UPI links | 2 |
Intel® Volume Management Device (VMD) | Y |
Intel® Run Sure Technology | Y |
Mode-based Execute Control (MBE) | Y |
Memory speed (max) | 2667 MHz |
Intel® Optane™ DC Persistent Memory technology | Y |
Intel® Deep Learning Boost (Intel® DL Boost) | Y |
Intel® Resource Director Technology (Intel® RDT) | Y |
Intel® Optane™ DC Persistent Memory Supported | Y |
Intel Speed Select Technology (SST) | N |
Component for | Server/workstation |
ECC | Y |
Memory channels | Hexa-channel |
Product type | Processor |
Processor ARK ID | 193392 |
Processor model | 5215M |
Thermal Design Power (TDP) | 85 W |
Maximum internal memory supported by processor | 2048 GB |
Processor family | Intel® Xeon® Gold |
Processor manufacturer | Intel |
Processor boost frequency | 3.4 GHz |
Processor cores | 10 |
Processor threads | 20 |
Processor cache | 13.75 MB |
PCI Express slots version | 3.0 |
Processor codename | Cascade Lake |
Processor lithography | 14 nm |
Processor operating modes | 64-bit |
Processor package size | 76.0 x 56.5 mm |
Processor socket | LGA 3647 (Socket P) |
Scalability | 4S |
On-board graphics card model | Not available |
Embedded options available | N |
Enhanced Intel SpeedStep Technology | Y |
Execute Disable Bit | Y |
Intel 64 | Y |
Intel Trusted Execution Technology | Y |
Intel TSX-NI | Y |
Intel Virtualization Technology (VT-x) | Y |
Intel VT-x with Extended Page Tables (EPT) | Y |
Intel® AES New Instructions (Intel® AES-NI) | Y |
Intel® Turbo Boost Technology | 2.0 |
Maximum number of PCI Express lanes | 48 |
Memory types supported by processor | DDR4-SDRAM |