| Read latency | 175 µs |
| Write latency | 100 µs |
| Width | 2.76" |
| Depth | 3.94" |
| Height | 0.276" |
| Weight | 2.47 oz |
| Hardware encryption | Y |
| Non-operating vibration | 3.13 G |
| Harmonized System (HS) code | 84717070 |
| Interface | Serial ATA III |
| Certification | Micron Green Standard Built with sulfur resistant resistors CE (Europe): EN 55032 Class B, RoHS FCC: CFR Title 47, Part 15 Class B UL: UL-60950-1, 2nd Edition BSMI (Taiwan): approval to CNS 13438 RCM (Australia, New Zealand): AS/NZS CISPR32 Class B KCC RRL (Korea): approval to KN 32 Class B, KN 35 Class B W.E.E.E.: Compliance with EU WEEE directive 2002/96/EC. TUV (Germany): approval to IEC60950/EN60950 VCCI (Japan): 2015-04 Class B IC (Canada): CISPR32 Class B: Canadian ICES-003:2016 |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Operating relative humidity (H-H) | 5 - 95 % |
| Operating shock | 1500 G |
| Power consumption (write) | 3.1 W |
| Power consumption (read) | 2.5 W |
| Write speed | 410 MB/s |
| Random write (4KB) | 36000 IOPS |
| Random read (4KB) | 85000 IOPS |
| Component for | Server/workstation |
| Data transfer rate | 6 Gbit/s |
| Hot-swap | Y |
| Mean time between failures (MTBF) | 3000000 h |
| SSD capacity | 480 GB |
| Memory type | 3D TLC NAND |
| Read speed | 540 MB/s |
| S.M.A.R.T. support | Y |
| Security algorithms | 256-bit AES |