Intel Celeron 3765U processor 1.9 GHz 2 MB L3

Intel Celeron 3765U. Processor family: Intel® Celeron®, Processor socket: BGA 1168, Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 16 GB, Memory types supported by processor: DDR3L-SDRAM,LPDDR3-SDRAM. On-board graphics card model: Intel® HD Graphics, On-board graphics card outputs supported: DisplayPort,HDMI,Embedded DisplayPort (eDP), On-board graphics card base frequency: 300 MHz. Market segment: Mobile, Use conditions: Embedded Broad Market Commercial Temp,Industrial Commercial Temp,PC/Client/Tablet, PCI Express configurations: 4x1,2x4. Package dimensions (WxDxH): 1.57 x 0.945 x 0.0512" (40 x 24 x 1.3 mm), Processor package size: 40mm x 24mm x 1.3mm
Manufacturer: INTEL
Availability: Out of Stock - on backorder and will be dispatched once in stock.
SKU: 5368473
Manufacturer part number: FH8065801620803
$134.82
Idle States Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.
Enhanced Intel SpeedStep® Technology Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
Thermal Monitoring Technologies Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.
Idle States Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.
Enhanced Intel SpeedStep® Technology Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
Thermal Monitoring Technologies Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.
Products specifications
Attribute nameAttribute value
Intel® Virtualization Technology (Intel® VT)VT-x,VT-d
L2 cache2048 KB
Commodity Classification Automated Tracking System (CCATS)G071701++
Product nameIntel Celeron 3765U (2M Cache, 1.90 GHz)
Supported memory typesDDR3L-SDRAM,LPDDR3-SDRAM
Born on dateQ2'15
Launch dateQ2'15
Graphics outputeDP/DP/HDMI
On-board graphics card outputs supportedDisplayPort,HDMI,Embedded DisplayPort (eDP)
Number of graphics cores1
Use conditionsEmbedded Broad Market Commercial Temp,Industrial Commercial Temp,PC/Client/Tablet
Maximum Memory16 GB
Maximum internal memory16384 MB
Video compression formatsY
Intel® Small Business Advantage (Intel® SBA)N
Intel Small Business Advantage (SBA) version0.00
Intel Smart Connect TechnologyN
Market segmentMobile
Processor brand nameIntel Celeron
Product familyIntel Celeron Processor
Cache memory2 MB
PCI Express CEM revision2.0
Video decodingY
Graphics max dynamic frequency850 MHz
Tjunction105 °C
On-board graphics cardY
Intel® Wireless Display (Intel® WiDi)Y
Intel® Insider™Y
Intel Clear Video TechnologyY
Supported instruction setsSSE4.1,SSE4.2
System bus rate5 GT/s
Memory clock speeds supported by processor1333,1600 MHz
Processor base frequency1.9 GHz
Intel® vPro™ Platform EligibilityN
On-board graphics card DirectX version11.2/12
Configurable TDP-down frequency0.6 GHz
Intel® Smart Response TechnologyN
Intel Smart Response Technology version0.00
Configurable TDP-down10 W
Cooler includedN
Intel® Rapid Start TechnologyN
Harmonized System (HS) code8542310001
BoxN
Bus bandwidth5
Bus type unitsGT/s
StatusLaunched
Last change63903513
Export Control Classification Number (ECCN)5A992CN3
Bus speed5 GT/s
Intel® Transactional Synchronization ExtensionsN
Features
Bandwidth5 MB/s
Memory channelsDual-channel
Product typeSystem on Chip
Other features
Package dimensions (WxDxH)1.57 x 0.945 x 0.0512"
Processor ARK ID84812
Processor
Processor model3765U
PCI Express configurations4x1,2x4
Processor codeSR242
Processor package size40mm x 24mm x 1.3mm mm
SteppingF0
Processor cache2048 KB
Processor codenameBroadwell
Processor seriesIntel Celeron Processor 3000 series for Mobile
Maximum internal memory supported by processor16 GB
Processor familyIntel® Celeron®
Processor manufacturerIntel
Processor cores2
Processor threads2
Bus typeDMI2
CPU configuration (max)1
PCI Express slots version2.0
Processor cache typeL3
Processor lithography14 nm
Processor operating modes64-bit
Processor socketBGA 1168
Thermal Design Power (TDP)15 W
On-board graphics card modelIntel® HD Graphics
Memory bandwidth supported by processor (max)25.6 GB/s
Conflict-Free processorY
Processor special features
Memory types supported by processorDDR3L-SDRAM,LPDDR3-SDRAM
Intel® AES New Instructions (Intel® AES-NI)N
Intel® OS GuardN
Embedded options availableY
Enhanced Intel SpeedStep TechnologyY
Execute Disable BitY
Graphics & IMC lithography14 nm
Intel 64Y
Intel Fast Memory AccessY
Intel FDI TechnologyY
Intel Flex Memory AccessY
Intel Identity Protection Technology version1.00
Intel Secure Key Technology version1.00
Intel Trusted Execution TechnologyN
Intel TSX-NIN
Intel TSX-NI version0.00
Intel Virtualization Technology (VT-x)Y
Intel VT-x with Extended Page Tables (EPT)Y
Intel® Clear Video HD Technology (Intel® CVT HD)N
Intel® Identity Protection Technology (Intel® IPT)Y
Intel® InTru™ 3D TechnologyY
Intel® Quick Sync Video TechnologyY
Intel® Secure KeyY
Intel® Turbo Boost TechnologyN
Maximum number of PCI Express lanes12
Thermal Monitoring TechnologiesY
Graphics
On-board graphics card dynamic frequency (max)850 MHz
On-board graphics card base frequency300 MHz
Number of displays supported (on-board graphics)3
Product tags
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