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StarTech.com HEATGREASE20 heat sink compound 1.066 W/m·K 0.847 oz (24 g)1
StarTech.com HEATGREASE20 heat sink compound 1.066 W/m·K 0.847 oz (24 g)1 StarTech.com HEATGREASE20 heat sink compound 1.066 W/m·K 0.847 oz (24 g)2

StarTech.com HEATGREASE20 heat sink compound 1.066 W/m·K 0.847 oz (24 g)

StarTech.com HEATGREASE20. Thermal conductivity: 1.066 W/m·K, Product color: White, Thermal resistance: 0.195 °C/W. Width: 2.83" (72 mm), Depth: 0.709" (18 mm), Height: 0.709" (18 mm). Package width: 3.31" (84 mm), Package depth: 5.98" (152 mm), Package height: 0.906" (23 mm)
Manufacturer: StarTech.com
Availability: Out of Stock - on backorder and will be dispatched once in stock.
SKU: 3084089
Manufacturer part number: HEATGREASE20
$13.93
The HEATGREASE20 CPU Thermal Paste Compound can be used to improve the effectiveness of a CPU cooler, by thermally bonding the surface of the CPU to the heatsink, which enables the heatsink and fan to work more efficiently to remove harmful heat from the CPU. This 20g tube of ceramic-based thermal grease is enough for a large number of CPU installations for most home or business computers or any other light application where good thermal bonding between two surfaces is required. Please see our support section for the Material Safety Data Sheet for HEATGREASE20.
The StarTech.com Advantage - Improves the heat transfer between a CPU and heatsink to keep the CPU running cooler - Effectively fills surface imperfections on CPU to prevent air pockets and help heat transfer - Ceramic-based compound that is electrically non-conductive, for safe use around electronics
The HEATGREASE20 CPU Thermal Paste Compound can be used to improve the effectiveness of a CPU cooler, by thermally bonding the surface of the CPU to the heatsink, which enables the heatsink and fan to work more efficiently to remove harmful heat from the CPU. This 20g tube of ceramic-based thermal grease is enough for a large number of CPU installations for most home or business computers or any other light application where good thermal bonding between two surfaces is required. Please see our support section for the Material Safety Data Sheet for HEATGREASE20.
The StarTech.com Advantage - Improves the heat transfer between a CPU and heatsink to keep the CPU running cooler - Effectively fills surface imperfections on CPU to prevent air pockets and help heat transfer - Ceramic-based compound that is electrically non-conductive, for safe use around electronics
Products specifications
Attribute nameAttribute value
Thermal resistance0.195 °C/W
Thermal conductivity1.066 W/m·K
Specific gravity2.3 g/cm³
Evaporation (@ 200°C/24h)0.001 %
Bleed (@ 200°C/24h)0.005 %
Width2.83"
Depth0.709"
Height0.709"
Weight0.847 oz
Technical details
Product colorWhite
Sustainability certificatesRoHS
Packaging data
Package height0.906"
Package width3.31"
Package depth5.98"
Package weight1.31 oz
Operational conditions
Storage temperature (T-T)-50 - 100 °C
Operating temperature (T-T)-20 - 100 °C
Operating relative humidity (H-H)10 - 80 %
Product tags
  • (56828)
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