Xeon

Hewlett Packard Enterprise Intel Xeon-Silver 4215R. Processor family: Intel Xeon Silver, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1024 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Scalability: 2S

Hewlett Packard Enterprise Intel Xeon-Silver 4215R. Processor family: Intel Xeon Silver, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1024 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Scalability: 2S

Hewlett Packard Enterprise Xeon P36920-B21. Processor family: Intel Xeon Silver, Processor socket: FCLGA4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Memory types supported by processor: DDR4-SDRAM, Memory clock speeds supported by processor: 2667 MHz. Width: 30.5" (775 mm), Depth: 22.2" (565 mm)

Hewlett Packard Enterprise Intel Xeon-Silver 4214R. Processor family: Intel Xeon Silver, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1024 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Scalability: 2S

Hewlett Packard Enterprise Intel Xeon-Silver 4214R. Processor family: Intel Xeon Silver, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1024 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Scalability: 2S

Hewlett Packard Enterprise Xeon Silver 4310. Processor family: Intel Xeon Silver, Processor socket: FCLGA4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6144 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 8 GB. Package type: Retail box

Hewlett Packard Enterprise P02498R-B21. Processor family: Intel® Xeon® Gold, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1000 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX-512, Scalability: 4S. Compatibility: DL380 GEN10

Hewlett Packard Enterprise Intel Xeon-Silver 4210R. Processor family: Intel Xeon Silver, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1024 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Scalability: 2S

Hewlett Packard Enterprise Intel Xeon Silver 4208. Processor family: Intel Xeon Silver, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1000 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX-512, Scalability: 2S. Compatibility: DL380 Gen10

Hewlett Packard Enterprise Intel Xeon Silver 4208. Processor family: Intel Xeon Silver, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1000 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX-512, Scalability: 2S. Compatibility: DL360 Gen10

Intel E7310. Processor family: Intel® Xeon® E7 Family, Processor socket: Socket 604 (mPGA604), Processor lithography: 65 nm. Market segment: Server, Number of Processing Die Transistors: 582 M, Processing Die size: 286 mm². Package width: 1.73" (44 mm), Package depth: 5.51" (140 mm), Package height: 4.61" (117 mm). Processor package size: 53.3mm x 53.3mm. Intel® Virtualization Technology (Intel® VT): VT-x, Cache memory: 4 MB

Intel Xeon E7420. Processor family: Intel® Xeon® E7 Family, Processor socket: Socket 604 (mPGA604), Processor lithography: 45 nm. Market segment: Server, Number of Processing Die Transistors: 1900 M, Processing Die size: 503 mm². Package width: 1.73" (44 mm), Package depth: 5.51" (140 mm), Package height: 4.61" (117 mm). Processor package size: 53.3mm x 53.3mm. Images Type Map: